Applications
High TCR VOx Microbolomers For IR Detectors
High Power Laser Damage Tolerant Coatings (HAMR)
VCSEL AR Coatings
BAW/SAW Device Trimming
Semiconductor Device Delayering
Au Etch (III-VI Semiconductor)
Superconductor Material Etch
R&D
• Advantages
Proprietary Bias Target Sputtering
No Beam Overspill – No Contamination, No Process
Particles/Defects
Stress Control – Better Adhesion, Higher Yield
Energy Control – Less Plasma Damage Higher Yield
Proprietary Low Damage Sputter Etching
Energy Control – Low Damage to Sensitive Devices
